Carpenter
R.W., Braue W., Cutler R.A. Transmission Electron
Microscopy of Liquid Phase Densified SiC // J. Mater. Res.
- 1991. - 6(9). - 1937.
Transmission electron microscopy was used
to characterize microstructures of SiC densified using a transient
liquid phase (resulting from the reaction of Al2O3
with Al4C3 ) by hot pressing at 1875 °C for
10 min in N2 . High resolution electron microscopy showed
that the SiC grain boundaries were free of glassy phases, suggesting
that all liquid phases crystallized upon cooling. Phases that might
be expected due to reactive sintering (i.e., AlN, Al2OC,
Al2O3, Al4O4C, Al3O3N,
or solid solutions of SiC, AlN, and Al2OC) were not observed.
However, significant Al, Si, O, and C concentrations were found at
all triple junctions of these rapidly densified ceramics.
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Chistyakov
A. A.; Gavrish A. M.; Ustichenko V. A. Crystal
Optics Constants for Aluminum Oxycarbide (Al4O4C)
// Neorg. Mater. - 1991. - 27(8). - 1657-1659. (Russian).
[no
abstract]
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Klemm
H., Tanihata K., Miyamoto Y. Gas Pressure Combustion
Sintering of Materials in the Titanium-Silicon-Carbon System
/ Hot Isostatic Pressing: Theory Appl., Proc. Int. Conf., 3rd. - London,
UK, 1991. - 451-456.
Processing
by gas-pressure combustion sintering (GPCS) to produce dense materials
in the system Ti-Si-C was studied. By systematic variations of the
reactant compn. it was possible to produce different materials consisting
of Ti5Si3, TiSi2, Ti3SiC2,
TiC, or SiC. The complete densification of the samples was not in
all cases successful. The time at high temps. was possibly too short
to densify the materials with more refractory character. Not all the
phases built up by combustion at high temps. are stable at lower temps.
and some reactions occur during cooling, influencing densification
and properties of the final material. Some properties of fully densified
samples produced by GPCS are given. The ceramic-metal composite produced
by higher addn. of Ti showed better mech. properties in bending strength
and fracture toughness.
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Misra
A. K. Thermochemical Analysis of the Silicon
Carbide - Alumina Reaction with Reference to Liquid-Phase Sintering
of Silicon Carbide // J. Am. Ceram. Soc. - 1991. - 74(2). -
345-351.
The stabilities of different phases in the
Si-Al-C-O system are calculated from thermodynamic considerations
with the objective of identifying the liquid phases formed during
sintering of SiC in the presence of Al2O3. It
is shown that a liquid phase can form at the sintering temperatures
by the reaction of SiC with Al2O3. Depending
of the carbon activity, the liquid can be either of the following:
Al2O3 + Al4C3, SiC + Al4C3,
or molten aluminum. The stability of the aluminosilicate melts that
can form by the reaction of Al2O3 with the surface
silica layer on SiC powders is also evaluated. Several factors that
influence liquid-phase sintering, such as the solubility of SiC in
the melts and the generation of gases during sintering, are discussed.
The results of the thermodynamic analysis are compared with the observed
sintering behavior for SiC.
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Oden
L. L. Reply to "Comment on 'Contribution
to the Phase Diagram Al4C3
- AlN - SiC'" // J. Am. Ceram. Soc. -
1991. - 74(9). - 2329.
[no
abstract]
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Oscroft
R. J., Thompson D. P. Comment on 'Contribution
to the Phase Diagram Al4C3-AlN-SiC'
// J. Am. Ceram. Soc. - 1991. - 74(9). - 2327-2328.
[no
abstract]
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Nishino
T., Urai S., Okamoto I, Naka M. Wetting and
Reaction Products Formed at the Interface Between Silicon Carbide
and Copper-Titanium Alloys // Yosetsu Gakkai Ronbunshu. - 1991.
- 9(4). - 519-525.
The contact angle of molten Cu-Ti alloys contg.
5-60 at.% Ti on SiC was investigated by using the sessile drop technique
at 1373 K in vacuum. The contact angle of molten Cu-Ti alloys reached
an equil. value in 3.6 ks at 1373 K. The equil. contact angle of Cu-Ti
alloys on SiC decreased drastically with increasing Ti content. Cu-Ti
alloys contg. .gtoreq.30 at.T Ti had an equil. contact angle of .ltoreq.
7°. The addn. of Ti to Cu depresses the reaction of Cu with SiC by
forming TiC and Ti3SiC2 at the SiC/Cu-Ti interface.
This behavior accounts for the superior wetting of SiC by Cu-Ti alloys.
The Cu-Ti alloys are useful fillers for brazing SiC.
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